RAFIQUL ISLAM, 480-213-4704
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EDUCATION
Harvard Publishing Executive Business Education, Intel Cohort, Leadership DIRECT (Mar 2015- Sept 2015)
PhD in Science and Engineering in Materials, Arizona State University (ASU), AZ, USA (Aug 2002 -Dec 2005)
MS in Chemical Engineering, Tennessee Technology University (TTU), TN, USA (Aug 1999-Dec 2000)
BS in Chemical Engineering, Bangladesh University of Engineering and Technology (BUET), Sep 1993- Dec 1998
INDUSTRY EMPLOYMENT HISTORY
2015-Present : Adjunct Faculty, Ira Fulton School of Engineering, Arizona State University (ASU), Tempe.
2015-Present : Engineering Manager, Fab Sort Manufacturing (FSM), Intel Corporation, Ocotillo, AZ
2014- 2015 : Litho Engineering Manager, Intel Corporation, SPTD, AZ
2010-2013 : Litho Area Coordinator/Senior Project Manager/Staff Engineer, Intel Corporation, DETD/SPTD, AZ
2006-2010 : Next generation substrate technology program management, Intel Corporation, MTD/ATTD, AZ
2001-2002 : Process Engineer (Microfluidics/Bonding/Alignment), EV Group Inc., AZ
Others:
Marathon Runner, Ironman, Avid Soccer, and Tennis player. Read Blog: RAFIQUL2015.blogspot.com
Co-chair of Embedded System (2016) and Grand Judge (2013) in Intel ISEF (World largest International science competition- over $5M award)
Served as “President” tenured two years in a non-profit organization (AABEA-AZ, USA);
Organize Science fair and Spelling bees as part of Non-profit organization AABEA
Raised funds for various organization including LSS and national society of multiple Sclerosis (MS).
Engage activities in social entrepreneurship and sustainability
Research: 3D printing and materials for bio-medical and electronic applications, Microfluidics, Nanoimprinting/soft lithography, Transmission Electron Microscopy in Biological and Energy Engineering.
Course Design is in progress: Growth and Processing of Semiconductor. Internet of things - Biological/Electrical/Computer applications
PATENTS AND TRADE SECRET (Several are in pipeline)
- Flexible and Stretchable Electronics Package with Thin Silicon Die and Stretchable Interconnects – filed for patents
- Advanced alignment for die placement during assembly process
INVITED SPEAKER AND PANEL MEMBER, SEMICON SOUTHWEST 2001
Semicon Southwest 2001: MEMS/MST Technology, Paper and presentation: R.Islam, C.Brubaker, P.Lindner, C.Schaefer, “State-of-the-Art Lithography and Wafer Bonding Application for MEMS” Invited Paper, Semicon Southwest 2001, Austin, TX, October 2001.
PUBLICATIONS
Intel Assembly and Test Technology Journal (IATTJ)
- D. V. Kulkarni, D. Xu, R. Islam, M. Tao, P. Alur, R. Shankar, S. Cho, J.. J. Beatty, "Flatness of large form factor packages – Summary and key modulators”, Intel Assembly and Test Technology- IATTJ, vol. 11, (2008)
- A. Aleksov, D. Kim, R. Swaminathan, H. Au, B. Roberts, R. Islam, D. He, and S. Sharan, “Large-Die Joint Failure, Implications on Silicon Design, and Remediation in Future Platforms” Intel Assembly and Test Technology- IATTJ, vol. 10, (2007)
- R. Islam , A. P. Alur, " Effect of Design Parameters and Substrate Manufacturing Process on Incoming Warpage for Large Die Package”, Intel Assembly and Test Technology- IATTJ, vol. 10, (2007)
Peer-reviewed Journals
- L. Zeng, E. Helgren, M. Rahimi, F. Hellman, R. Islam, B. J. Wilkens, R. J. Culbertson, D. J. Smith, ''Quenched magnetic moment in Mn-doped amorphous Si films'', Phys. Rev. B, Brief Report, 77, 073306 (2008)
- E. Helgren, F. Hellman, L. Zeng, N. Sinenian, R. Islam, D. J. Smith, Magnetic and transport properties of amorphous GdxGe1−x alloys near the metal-insulator transition'', Phys. Rev. B. 76, 184440 (2007)
- L. Zeng, E. Helgren, F. Hellman, R. Islam, D. J. Smith, J. W. Ager III, ''Microstructure, magneto-transport and magnetic properties of Gd-doped magnetron-sputtered amorphous carbon'', Phys. Rev. B. 75, 235450, (2007)
- E. Helgren, L. Zeng, D. Queen, R. Islam, D. J. Smith, F. Hellman, ''Concentration dependent microstructure and transport properties of the magnetic semiconductor Gd-Si'', J. Appl. Phys., 101, 093712 (2007)
- E. Guillotel, L. Zeng, E. Helgren, R. Islam, D. J. Smith, F. Hellman, ''Effects of annealing on amorphous GdxSi1-x near the metal-insulator transition'', J. Appl. Phys. 101, 023908 (2007).
- L. Zeng, E. Helgren, R. Islam, D. J. Smith, F. Hellman, ''Growth and microstructure dependence of electronic and magnetic properties in magnetically doped Gd-Si amorphous semiconductor'', Phys. Rev. B, 75, 184404 (2007)
- B. L. Zink, R. Islam, D. J. Smith, F. Hellman, Excess modes and enhanced scattering in rare-earth-doped amorphous silicon thin films'', Phys. Rev. B, 74, 205209 (2006)
- S. Liang , R. Islam, D. J. Smith, P. Bennett, “Phase transformation in FeSi2 nanowires”, Journal of Crystal Growth 295 166–171 (2006)
- S. Liang, R. Islam, D. J. Smith, P. Bennett, “Magnetic iron silicide nanowires on Si(110)”, Applied Phys. Letter. 88, 113111 (2006)
- D. Querlioz, D. Queen, F. Hellman, R. Islam, D. J. Smith, "Beneficial effects of annealing on amorphous Nb-Si thin film thermometers", Applied Phys. Letter. 87, 221901 (2005)
- J. J. Biernacki, R. Subramanian, M. R. Islam, C. Schewe and M. C. Rogers, Gas phase mixing and dispersion in a diffusion Furnace, J. Elec. Chem. Soc. 151 (1), (2002)
Conference papers (Excerpted from conference papers)
- Abhijat Goyal, Srinivas Tadigadapa, Rafiqul Islam, “Solder bonding for microelectromecanical systems (MEMS) application”, Invited paper , Reliability, Testing, and Characterization of MEMS/MOEMS II; SPIE’s Micromachining and Microfabrication 2003, San Jose, Proc. SPIE Vol. 4980, p. 281-288, , January (2003)
- P. Lindner, V. Dragoi, T. Glinsner, C. Schaefer, R. Islam, “3D interconnect through aligned wafer level bonding, IEEE/Electronic Components & Technology Conference (ECTC), San Diego, California, USA 52nd , 28-31, pp 1439 – 1443, May (2002)
- R.Islam , B. Wieder, P. Lindner, T. Glinsner, C. Schaefer, “One micron precision optically aligned method for hot-embossing and nanoimprinting” Sensors, 2002. Proceedings of IEEE, Pages:931 - 935 vol.2 IEEE Sensors, Orlando, FL, June (2002)
- C.Brubaker, R.Islam, H.Luesbrink, “Ultra-thick lithography for advanced packaging and MEMS”, Advances in Resist Technology and Processing XIX; SPIE’s 27th Annual International Symposium on Microlithography, Santa Clara, CA, Proc. SPIE Vol. 4690, p. 270-276, Jul (2002)
- R.Islam , C.Brubaker, P.Lindner, C.Schaefer, “State-of-the-Art lithography and wafer Bonding application for MEMS” Invited Paper, Semicon Southwest 2001, Austin, TX, October (2001)
- Biernacki, J.; Islam, M.; Subraminium, R.; Rogers, M.; Schewe, C.; Dynamic Simulations and Analysis for Diffusion Furnace Processing, Presentation in AICHE annual meeting, November (2000)
- R.Islam , T. Glinsner, “Microfluidics technology and polymer nanoimprinting”-Poster Microfluidics and BioMEMS; Micromachining and Microfabrication 2001, SanFransisco, CA, Proc. SPIE Vol. 4560, p. 250-255, Sep 2001.
- R.Islam , C.Brubaker,” Advanced Lithography for High Aspect ratio MEMS Technology” Poster-MEMS Conference 2001, Berkeley, CA, 2001.