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Owen Hildreth

Asst Professor
Faculty, TEMPE Campus, Mailcode 6106
Asst Professor
Faculty, TEMPE Campus, Mailcode 6106
Biography

Dr. Owen Hildreth is an Assistant Professor at the School for Engineering of Matter, Transport, and Energy (SEMTE) at Arizona State University (ASU).  He received his B.S. in Mechanical Engineering from the University of California, San Diego in 2002 and worked for five years as a mechanical engineer designing consumer products.  After returning to school, in 2012 he received his Ph.D. in Materials Science and Engineering from the Georgia Institute of Technology under the supervision of Prof. C. P. Wong where he identified the mechanism for catalyst motion in metal assisted chemical etching (MacEtch) for applications in 3D nanofabrication.  Prior to his appointment at ASU he was a National Research Council (NRC) postdoctoral fellow at the National Institute of Technology (NIST) where he continued his study of MacEtch and expanded into additive manufacturing using reactive inks.  He current research areas focus on additive manufacturing from the nanometer to centimeter scales, including Coulombic repulsion in ultra-nearfield electrohydrodynamic printing; mass transport, reaction kinetics, and interface design in reactive inks for stretchable electronics, photovoltaics, and microfluidic devcies; sensitization kinetics, microstructure evolution, dilution, and corrosion of metals fabricated using Powder Bed Fusion (PBF) and Directed Energy Deposition (DED) technologies.

Education

B.S. Mechanical Engineering; University of Californa, San Diego; 2002

Ph.D. Materials Science and Engineering, Georgia Institute of Technology, 2012

 

 

 

Research Interests

Scalable 3D nanofabrication

Additive nanofabrication

New ink chemistries that print solids instead of nanoparticle clusters

Metal-assisted Chemical Etching

Printable MEMS and microfluidic devices

Research Group

The Hildreth Research Group focuses on phenomena involved in nanometer to centimeter scale additive manufacturing technologies.  Through fundamental studies on mass transport, heat transfer, chemical kinetics, electrohydrodynamics, and corrosion, we are advancing the state-of-the-art for printed electronics and microfluidics; bringing dissolvable supports to 3D printed metals; and are reducing silver consumption in photovoltatic cells by 90%.

 

 

Publications

Book Chapters

At ASU

1.     Hildreth, O*.; Wong, C. P.; Li, L. Applications of Metal-Assisted Chemical Etching in Microelectronics Packaging.  Materials for Advanced Packaging, Springer, Boston, 2016, 879-992

Prior to ASU

2.     Lin, W.; Hildreth, O.; Wong, C. P.*; Carbon Nanotubes as Thermal Interface Materials for Electronic and Photonic Packaging; Bernd, M.; Reichl, H., Eds.; Smart System Integration and Reliability; Boldernbogen: Dresden, 2010, 56-67

Refereed Journal Publications

At ASU

1.     Lefky, C. S.; Zucker, B#. Nassar, A. R.; Simpson, T. W.; Hildreth, O*. Dissolvable Supports in Powder Bed Fusion Printed Stainless Steel. 3D Print. Addit. Manuf. 4, 3-11, 2017.

2.     Jeffries, A. M.; Mamidanna, A.; Ding, L.; Hildreth, O.; Bertoni, M. I. Low-Temperature Drop-on-Demand Reactive Silver Inks for Solar Cell Front-Grid Metallization. IEEE Journal of Photovoltaics 2017, 7, 37–43.

3.     Zhao, Z.; Mamidanna, A.; Lefky, C. S.; Hildreth, O.; Alford, T. L.* A Percolative Approach to Investigate Electromigration Failure in Printed Ag Structures. J Appl Phys 2016, 120, 125104–125106.

4.     Lefky, C. S.; Mamidanna, A.; Huang, Y.; Hildreth, O*. Impact of Solvent Selection and Temperature on Porosity and Resistance of Printed Self‐Reducing Silver Inks. Phys Status Solidi A 2016, 1–8.

5.     Mamidanna, A.; Song, Z.; Lv, C.; Lefky, C. S.; Jiang, H.; Hildreth, O*. Printing Stretchable Spiral Interconnects Using Reactive Ink Chemistries. ACS Appl. Mater. Interfaces 2016, 8, 12594–12598.

6.     Lefky, C. S.; Nassar, A. R.; Simpson, T. W.; Hildreth, O*. Dissolvable Supports in Powder Bed Fusion Printed Stainless Steel. 3D Print. Addit. Manuf. 2016.

7.     Hildreth, O.*; Nassar, A. R.; Chasse, K. R. Dissolvable Metal Supports for 3D Direct Metal Printing. 3D Print. Addit. Manuf. 2016, 3, 91–97.

8.     Liu, S.; Sun, X.; Hildreth, O.; Rykaczewski, K*. Design and Characterization of a Single Channel Two-Liquid Capacitor and Its Application to Hyperelastic Strain Sensing. Lab on a Chip 2015, 15, 1376–1384.

Prior to ASU

1.     Hildreth, O.; Schmidt, D. R. Vapor Phase Metal‐Assisted Chemical Etching of Silicon. Advanced Functional Materials, 2014, 24, 3827–3833.

2.     Hildreth, O.; Honrao, C.; Sundaram, V.; Wong, C. P. Combining Electroless Filling with Metal-Assisted Chemical Etching to Fabricate 3D Metallic Structures with Nanoscale Resolutions. ECS Solid State Letters 2013, 2, 39–41.

3.     Hildreth, O.; Rykaczewski, K.; Fedorov, A. G.; Wong, C. P. A DLVO Model for Catalyst Motion in Metal-Assisted Chemical Etching Based Upon Controlled Out-of-Plane Rotational Etching and Force-Displacement Measurements. Nanoscale 2013, 5, 961–970.

4.     Hildreth, O.; Fedorov, A. G.; Wong, C. P. 3D Spirals with Controlled Chirality Fabricated Using Metal-Assisted Chemical Etching of Silicon. ACS Nano 2012, 6, 10004–10012.

5.     Hildreth, O.; Cola, B.; Graham, S.; Wong, C. P. Conformally Coating Vertically Aligned Carbon Nanotube Arrays Using Thermal Decomposition of Iron Pentacarbonyl. J Vac Sci Technol B, 2012, 30, 03D101–03D101–4.

6.     Hildreth, O.; Rykaczewski, K.; Wong, C. P. Participation of Focused Ion Beam Implanted Gallium Ions in Metal-Assisted Chemical Etching of Silicon. J Vac Sci Technol B 2012, 30, 040603.

7.     Rykaczewski, K.; Hildreth, O.; Wong, C. P.; Fedorov, A. G.; Scott, J. H. J. Guided Three-Dimensional Catalyst Folding During Metal-Assisted Chemical Etching of Silicon. Nano Letters 2011, 11, 2369–2374.

8.     Hildreth, O.; Brown, D.; Wong, C. P. 3D Out-of-Plane Rotational Etching with Pinned Catalysts in Metal-Assisted Chemical Etching of Silicon. Advanced Functional Materials 2011, 21, 3119–3128.

9.     Rykaczewski, K.; Hildreth, O.; Wong, C. P.; Fedorov, A. G.; Scott, J. H. J. Directed 2D-to-3D Pattern Transfer Method for Controlled Fabrication of Topologically Complex 3D Features in Silicon. Adv. Mater. 2011, 23, 659–663.

10.  Lin, Z.; Liu, Y.; Yao, Y.; Hildreth, O.; Li, Z.; Moon, K.; Wong, C. P. Superior Capacitance of Functionalized Graphene. The Journal of Physical Chemistry C 2011, 115, 7120–7125.

11.  Rykaczewski, K.; Hildreth, O.; Kulkarni, D.; Henry, M. R.; Kim, S. K.; Wong, C. P.; Tsukruk, V. V.; Fedorov, A. G. Maskless and Resist-Free Rapid Prototyping of Three-Dimensional Structures Through Electron Beam Induced Deposition (EBID) of Carbon in Combination with Metal-Assisted Chemical Etching (MaCE) of Silicon. ACS Appl. Mater. Interfaces 2010, 2, 969–973.

12.  Hildreth, O.; Lin, W.; Wong, C. P. Effect of Catalyst Shape and Etchant Composition on Etching Direction in Metal-Assisted Chemical Etching of Silicon to Fabricate 3D Nanostructures. ACS Nano 2009, 3, 4033–4042.

13.  Lin, W.; Xiu, Y.; Jiang, H.; Zhang, R.; Hildreth, O.; Moon, K.-S.; Wong, C. P. Self-Assembled Monolayer-Assisted Chemical Transfer of in Situ Functionalized Carbon Nanotubes. J. Am. Chem. Soc. 2008, 130, 9636- 9637.

Refereed Journal Publications Submitted and Under Preparation

Submitted

1.     Lefky, C. S.; Zucker, B#. Nassar, A. R.; Simpson, T. W.; Hildreth, O*. Dissolvable Supports in Powder Bed Fusion Printed Stainless Steel. 3D Print. Addit. Manuf. Under review 2016.

Under Preparation

1.     Lefky, C. S.; Zucker, B.#; Nassar, A. R.; Simpson, T. W.; Hildreth, O*. Dilution and Cross-Profile Corrosion in Directed Energy Deposited Steels.  In preparation for J. Electrochem. Soc., 2016

2.     Lefky, C. S.; Zucker, B.#; Hildreth, O*. Sensitization and Dissolution Kinetics of Powder Bed Fusion Printed Stainless Steel.  In preparation for ACS Appl. Mater. and Inter. 2016

3.     Mamidanna, A.; Hildreth, O*. Drop-on-Demand Printing of Microfluidic Devices Using Reactive Ink Chemistries.  In preparation for Lab on a Chip, 2016

4.     Lefky, C. S.; Kim, A.#, Hildreth, O*. High Resolution Electrohydrodynamic Printing of Silver.  In preparation for ACS Nano, 2016

Refereed Conference Proceedings

1.     Lefky, C. S.; Nassar, A. R.; Simpson, T. W.; Hildreth, O*. Dissolvable Metal Supports for Printed Metal Parts; Solid Freeform Fabrication Austin, 2016; pp. 1–10.

2.     Jeffries, A.; Mamidanna, A.; Ding, L.; Hildreth, O.; Bertoni, M*. Reactive Silver Ink as Front Contacts for High Efficiency Silicon Heterojunction Solar Cells. Presented at IEEE Photovoltaics Specialists Conference; 2016; pp. 1–3.

3.     Jeffries, A.; Mamidanna, A.; Clenney, J.; Ding, L.; Hildreth, O.; Bertoni, M*. Innovative Methods for Low-Temperature Contact Formation for Photovoltaics Applications. Presented at IEEE Photovoltaics Specialists Conference; New Orleans, 2015; pp. 1–5.

4.     Wong, C. P. *; Li, L.; Hildreth, O. Nano Etching via Metal-Assisted Chemical Etching (Mace) for Through Silicon via (TSTV) Stacked Chips Application. Presented at Advanced Optoelectronics for Energy and Environment, Wuhan, China 2013, 1–3.

Presentations

Short Course Development and Instruction

1.     Hildreth, O*; Li, X.; Short Course on Metal-assisted Chemical Etching for the 2015 Spring meeting of the Materials Research Society

Invited Presentations at Institutes

International Institutes

1.     Hildreth, O*; and Wong, C.P, Fabricating 3D Nano and Micron-sized Structures using Metal-assisted Chemical Etching of Silicon, Deutsches Elektronen-Synchrotron, Hamburg Germany, 2013

2.     Hildreth, O*; and Wong, C.P, Fabricating 3D Nano and Micron-sized Structures using Metal-assisted Chemical Etching of Silicon. École Polytechnique, Paliseau France, 2013

National Institutes

3.     Hildreth, O.*; and Wong, C.P, 3D Nanofabrication Technology using Metal-assisted Chemical Etching of Silicon.  Colorado School of Mines, Metallurgical and Materials Engineering Department, Golden, CO, 2013

4.     Hildreth, O.*; and Wong, C.P, Etching 3D Nanostructures in Silicon using Metal-assisted Chemical Etching, Invited talk for Nano@Tech in Atlanta, GA, 2011.

5.     Hildreth, O.*; and Wong, C.P, Cycloids, Spirals, and Sloping Channels: 3D Nanofabrication in Silicon Using Metal-assisted Chemical Etching, Presented at the National Institute of Standards and Technology in Gaithersburg, 2010.

Invited Presentations at Conferences

International Conferences

1.     Hildreth, O*; and Wong, C.P.; Fabricating 3D Nano and Micron-sized Structures using Metal-assisted Chemical Etching of Silicon; Presented at, Metamaterials 2013, Bordeaux France, 2013

National Conferences

1.     Hildreth, O*; Catalyst motion in Metal-assisted Chemical Etching; Presented at Electron, Ion, and Photon Beam Technology and Nanofabrication, Pittsburg, 2016

2.     Hildreth, O*; Simpson, T.; Electrochemistry and corrosion of multi-metal printed structures; Presented at SPIE West, San Francisco, 2016

3.     Wong, CP.; Hildreth, O*.; Recent Advances on Metal-Assisted Chemical Etching (MaCE) for High Performance through Silicon Vias (TSV) Applications. Presented at the Materials Research Society, Spring 2016, Phoenix

National Conferences

1.     Lefky, C. S.; Hildreth, O*. High Resolution Electrohydrodynamic Printing of Self-Reducing Silver Ink. Presented at the Solid Freeform Fabrication Conference, Austin 2016

2.     Lefky, C. S.; Nassar, A. R.; Simpson, T. W.; Hildreth, O. Dissolvable Metal Supports for Printed Metal Parts; Presented at the Solid Freeform Fabrication Austin, 2016; pp. 1–10.

3.     Mamidanna, A.; Song, Z.; Lv, C.; Lefky, C. S.; Jiang, H.; Hildreth, O*. Fabrication of a Stretchable Electronics Device Using Reactive Ink Chemistries. Presented at the Solid Freeform Fabrication Conference, Austin 2016

4.     Jefferies, A.; Mamidanna, A.; Hildreth, O.; Bertoni, M. *; Optical Characteristics of Reactive Silver Inks as Front Electrodes for High Efficiency Silicon Heterojunction Solar Cells.  Presented at the Materials Research Society, Spring 2016, Phoenix.

5.     Mamidanna, A.; Zhuo, Z.; Alford, T.; Hildreth, O. *; Electromigration Phenomena in Ag and Cu Lines Printed Using Self-Reducing Reactive Inks.  Presented at the Materials Research Society, Spring 2016, Phoenix.

6.     Lefky, C.; Hildreth, O*.; High Resolution Electrohydrodynamic Printing of Silver and Glass Reactive Inks.  Presented at the Materials Research Society, Spring 2016, Phoenix.

7.     Arnold, G.#; Lefky, C.; Hildreth. O*.; Non-Contact Location System for Precision Placement Of Nanostructures in EHD Printing. Presented at the Materials Research Society, Spring 2016, Phoenix.

8.     Huang, Y.; Mamidanna, A; Hildreth, O*.; Drop-on-Demand Printing of SiO2 Dielectrics from Sol-gel Chemistries. Presented at the Materials Research Society, Spring 2016, Phoenix.

9.     Mamidanna, A.; Lv, C.; Song. Z.; Jiang, H.; Hildreth, O*.; Inkjet Printed Serpentine Stretchable Electronics Using Reactive Ink Chemistries. Presented at the Materials Research Society, Spring 2016, Phoenix.

10.  Jeffries, A.; Mamidanna, A.; Clenney, J.; Ding, L.; Hildreth, O.; Bertoni, M*. Innovative Methods for Low-Temperature Contact Formation for Photovoltaics Applications. Presented at the IEEE Photovoltaics Specialists Conferece; New Orleans, 2015; pp. 1–5.

11.  Hildreth, O*.; Catalyst motion in Metal-assisted Chemical Etching, Presented at the Materials Research Society, Spring 2015, Phoenix.

12.  Mamidanna, A.; Lefky, C.; Hildreth, O*. Ink Composition of PEG Filler Inks for Printed 3D Microfluidic Devices. Presented at the Materials Research Society, Spring 2015, Phoenix.

13.  Hildreth, O and C. P. Wong, Fabricating chiral 3D, micron- to nano-sized structures in a single lithography/etch cycle using Metal-assisted Chemical Etching.  Presented at the Materials Research Society Spring Meeting in San Francisco, CA, 2013

14.  Hildreth, O and C. P. Wong, Out-of-Plane Rotation in Metal-Assisted Chemical Etching for Complex 3D Nano-scale to Micron-scale Manufacturing, Presented at the Materials Research Society in San Francisco, CA, 2011.

15.  Hildreth, O and C. P. Wong, Motility of silver nanorods in metal-assisted chemical etching of silicon, Presented at the Proceedings of the Materials Research Society in San Francisco, CA, 2010.

16.  Hildreth, O, C. Alvarez, and C. P. Wong, Tungsten as a CMOS compatible catalyst for the metal-assisted chemical etching of silicon to create 2D and 3D nanostructures, Presented at the Electronic Components and Technology Conference in Las Vegas, NV, 2010.

17.  Hildreth, O, W. Lin, C. Alvarez and C. P. Wong .Novel Method to Extract Arrays of Aligned Carbon Nanotube Bundles from CNT film using Solder Ball Grid Arrays for Higher Performance Device Interconnects. Paper presented at the Electronic Components and Technology Conference, San Diego 2009.

18.  Hildreth, O, Y. Xiu and C. P. Wong. Wet Chemical Method to Etch Sophisticated Nanostructures into Silicon Wafers using sub-25nm Feature Sizes and High Aspect Ratios. Paper presented at the Electronic Components and Technology Conference, 2009.

19.  Li, Y.; Zhang, R.; Zhu, L.; Lin, W.; Hildreth, O.; Jiang, H.; Lu, J.; Xiu, Y.; Liu, Y.; Moon, J.;. NANO Materials and Composites for Electronic and Photo Packaging. In Presented at 9th IEEE Conference on Nanotechnology; 2009, 1–3.

Patents

Awarded Patents

1.      O. Hildreth, Y. Xiu, and C. P. Wong. Methods and Systems for Metal-assisted Chemical Etching of Substrates, Patent #US8278191B2, Issued 10/02/2012.

2.     O. Hildreth. Liquid Deposition Composition and Process for Forming Metal Therefrom, Application #US20150191825, Filed 0/11/2014, Allowed 10/18/2016, Issue in process.

3.     Hildreth, OArticle with Gradient Property and Processes for Selective Etching, Patent #US9580809 B2, Filed 01/14/2015, Issued 02/28/2017

 

Patent Applications Outstanding

1.     Hildreth, O.; Lefky, C.; Abdalla, N.; Simpson, T.; Direct Support Dissolution for 3D Printed Metals and Oxides, Application, #US62/400,464, Filed 09/27/2016

2.     Hildreth, O.; Lefky, C.; Wright, D.; Abdalla, N. Simpson, T.; Dissolving Metal Supports in 3D Printed Metals and Ceramics Using Sensitization, Application #US62/363,034, Filed on 08/17/2016

3.     Hildreth, O.; Abdalla, N.; Simpson, T.; Fabricating Metal or Ceramic Components using 3D printing with Dissolvable Supports of a Different Material, Application #US62/295,912, Filed on 02/16/2016

4.     Hildreth, O.; Hsu, K.; Nassar, A.; Simpson, T.; Process Controlled Dissolvable Supports in 3D Printing of Metal or Ceramic Components; Applications #US62/295,918, Filed on 02/16/2016

5.     Hildreth, O. Article and Process for Selective Deposition, Application #US20150126031, Filed 01/14/2015.

6.     Hildreth, O. Article and Process for Selective Etching, Application #US20150147885, Filed 03/11/14, Filed 01/14/2015.

Invention Disclosures and Provisional Patents

1.     Hildreth, O.; Lefky, C.; Abdalla, N. Simpson, T.; Direct Support Dissolution for 3D Printed Metals and Oxide. Submitted to AZTe on 09/01/2016

2.     Bertoni, M.; Jefferies, A.; Mamidanna, A.; Hildreth, O.; Binding Technology for Reactive Inks. Submitted to AZTe on 09/01/2016

3.     Bertoni, M.; Jefferies, A.; Mamidanna, A.; Hildreth, O.; Application of High Precision Printing for Solar Cell Technologies. Submitted to AZTe on 09/01/2016

4.     Bertoni, M.; Jefferies, A.; Mamidanna, A.; Hildreth, O.; Conductive Adhesion Promoters for Reactive Inks. Submitted to AZTe on 07/05/2016

5.     Hildreth, O.; Silver Reactive Ink Recipe. Submitted to AZTe on 05/31/2016

6.     Hildreth, O.; Abdalla, T.; Nassar, A.; Wright, D.; Treatment for Self-Limiting 3D Printed Dissolvable Metal and Oxide Supports. Submitted to AZTe on 04/06/2016

7.     Hildreth, O.; Abdalla, T.; Nassar, A.; Process Controlled Dissolvable Supports in 3D Metals Printing. Submitted to AZTe on 02/05/2016

8.     Hildreth, O.; Abdalla, T.; Nassar, A.; Dissolvable Metal Supports in 3D Printed Metals and Oxides. Submitted to AZTe on 12/15/2015

9.     Hildreth, O.; Arnold, G.; Sanders, A.; Non-Contact Methods to Locate Sharp Tips. Submitted to AZTe on 05/27/2015

10.  Hildreth, O.; Controlling Localized Metal and/or Oxide Composition(s) Using Reactive Ink Printing. Submitted to AZTe on 05/27/2015

Research Activity
Fall 2017
Course NumberCourse Title
ASU 101-MEEThe ASU Experience
MAE 201Mech. Particles/Rigid Bodies I
MSE 492Honors Directed Study
MAE 599Thesis
MSE 792Research
MAE 792Research
MAE 799Dissertation
Summer 2017
Course NumberCourse Title
MAE 792Research
Spring 2017
Course NumberCourse Title
MSE 493Honors Thesis
MAE 599Thesis
MSE 792Research
MAE 792Research
Fall 2016
Course NumberCourse Title
ASU 101-MEEThe ASU Experience
MEE 342Principles Mechanical Design
MSE 492Honors Directed Study
MAE 599Thesis
MAE 792Research
Summer 2016
Course NumberCourse Title
MAE 792Research
Spring 2016
Course NumberCourse Title
MAE 494Special Topics
MAE 598Special Topics
MAE 599Thesis
MSE 792Research
MAE 792Research
Fall 2015
Course NumberCourse Title
ASU 101-MEEThe ASU Experience
MEE 342Principles Mechanical Design
MAE 599Thesis
MAE 792Research
Summer 2015
Course NumberCourse Title
MSE 792Research
MAE 792Research
Spring 2015
Course NumberCourse Title
MEE 342Principles Mechanical Design
MAE 599Thesis
MSE 792Research
MAE 792Research
Fall 2014
Course NumberCourse Title
MAE 599Thesis
MAE 792Research
Expertise Areas